TSMC’s Phenomenal 2nm Yield Rates Would Likely Put Alternatives From Samsung & Intel Foundry Way Behind; Apple, NVIDIA & AMD to Be Major Customers

Well, it seems like the Taiwan chip giant, TSMC, has plans to dominate the future of the chip market as well, since it is now reported that the 2nm node is showing impressive progress.
TSMC Is In Line To Once Again Dominate The Chip Segment, As The Taiwan Giant Sees Impressive Yield Rates With 2nm
For those unaware, TSMC has long dominated the chip market for several years now, and it widened the competition starting from its 5nm node, and then progressing up to 3nm. This was mainly due to how the company was the first to adopt newer methods, and with the extensive R&D resources at hand, TSMC didn’t let the likes of Samsung or Intel Foundry catch up. Now, according to a report by the Taiwan Economic Daily, TSMC’s 2nm yield rate has crossed the threshold for stable mass production and is significantly ahead of competitors.
It is reported that TSMC’s 2nm yield rates currently stand at 60%, which is significantly ahead of the likes of Samsung, which currently stands at 40%. Interestingly, TSMC’s 2nm process is apparently the highest-rated solution in the market, which is why firms like NVIDIA, Apple, and AMD are reported to have reserved production lines for their respective products. AMD has already announced that its next-gen EPYC Venice server CPUs will utilize TSMC’s 2nm node, marking its first formal adoption from the industry.

As for Samsung, despite adopting the GAA technique the earliest in the market, the Korean giant has failed to see traction. However, notably, Samsung is said to have seen progress with its 2nm process as well, as the company has reported a steady increase in yield rates. Samsung is in line to be the secondary supplier alongside TSMC, but this depends on which firm manages to achieve a stable mass production. However, for now, it is clear that TSMC has a major lead here, and this will likely continue to remain, given how yield rates are evolving.