Apple’s A20 Rumored To Be Exclusive To The iPhone 18 Pro, iPhone 18 Pro Max And The Company’s Foldable Flagship, Will Leverage TSMC’s Advanced 2nm Process Combined With The Newer WMCM Packaging
TSMC might have started accepting orders for its 2nm wafers, but the first chipsets fabricated on this cutting-edge lithography are not expected to arrive until late next year. As the majority of you are well aware, Apple likely pounced on the opportunity to be the first recipients of this technology, with its A20 rumored to be mass produced on the 2nm process. However, the same rumor claims that the Cupertino firm will employ the foundry giant’s WMCM (Wafer-Level Multi-Chip Module) packaging, bringing in more benefits, but customers can only experience these if they intend on making the iPhone 18 Pro, iPhone 18 Pro Max, or Apple’s upcoming foldable flagship their daily driver.
The latest rumor also claims that Apple will not be upping the RAM count on any iPhone model that will ship with the A20
The efforts to bring WMCM packaging to the A20 will be highly beneficial for Apple because it will allow the latter to maintain the chipset’s footprint while having immense flexibility in combining different components. In short, multiple dies such as the CPU, GPU, memory, and other parts can be integrated at a wafer level, before being sliced into individual chips. This approach will help Apple to mass manufacture smaller chipsets that are considerably power-efficient, but also powerful at the same time, leading to an incredible ‘performance per watt’ metric.
China Times reports that this A20 upgrade will arrive for the iPhone 18 Pro, the iPhone 18 Pro Max, and Apple’s foldable flagship, which the rumor refers to as the iPhone 18 Fold. TSMC’s production line specifically for WMCM chipsets will be located Chiayi AP7, with an estimated monthly production capacity of 50,000 pieces by the end of 2026. Interestingly, the RAM count will not change from this year, with Apple said to retain the 12GB limit. We have reported about the iPhone 18 series shifting to TSMC’s WMCM packaging before, while also talking about a separate rumor claiming that the A20 will be 15 percent faster than the A19 at the same power draw.
The rumor does not mention whether the less expensive iPhone 18 models will be treated to chipsets featuring WMCM packaging, or if Apple intends to save on design and production costs by sticking with the older InFo (Integrated Fan-Out) packaging. All of these answers will be provided in the fourth quarter of 2026, when the iPhone 18 family goes official, so stay tuned.
News Source: China Times
