Intel Foundry Reveals Plans For “Process Leadership” At Direct Connect 2025; Unveils Cutting-Edge 14A Process Along With Advanced 18A Derivatives

Intel’s Direct Connect 2025 has given a rundown on what the IFS will work on moving into the future as the new CEO tries to turn the foundry momentum around.

Intel Foundry’s 14A Process Is Now In Early Testing Stages, Features PowerVia 2.0 & Slated For H2 2026

Well, Intel’s new CEO, Lip-Bu Tan, has taken over the stage for the second time since he took over the office, this time at Direct Connect 2025. Jumping into the crux, Intel has revealed an updated foundry roadmap, firstly adding new 18A derivatives, and announcing the enablement of the high-end 14A process. Team Blue claims that they are already working with partners of 14A, sharing early versions of the Process Design Kit (PDK), and based on what we have heard, customers are impressed by Intel’s implementation of their next cutting-edge node.

Diving a bit into Intel’s 14A process, it is revealed that the node will feature the firm’s second-generation PowerVia implementation, called PowerDirect, which is a much more power-efficient method that focuses directly on supplying and draining transistor power through specialized contacts. So, with 14A, Intel is essentially two generations ahead of TSMC when it comes to employing backside power delivery, which shows that the foundry has plans to dominate the markets moving into the future.

Apart from 14A, the second most significant announcement was probably about the new 18A derivatives, called the 18A-P and 18A-PT. It is claimed that this particular node is a “performance-oriented” process, seeing higher gains than the original node. The more interesting announcement is the 18A-PT, which is the company’s first node to support Foveros Direct 3D hybrid bonding, allowing it to compete with TSMC’s interconnect implementations.

This is a developing story….