NVIDIA Selects Micron for Large-Scale SOCAMM Deployment

NVIDIA has revealed last week its plan to roll out 600,000 to 800,000 SOCAMM memory modules in 2025. This move puts SOCAMM technology in a position to replace current high-bandwidth memory (HBM) options. NVIDIA aims to use these modules in its upcoming AI products such as the GB300 “Blackwell” platform and AI PC Digits system, which it showed off at GTC 2025. Industry reports indicate that NVIDIA has communicated projected order quantities to memory and substrate suppliers. NVIDIA engaged three major memory manufacturers: Samsung Electronics, SK Hynix, and Micron Technology for SOCAMM co-development. As Digitimes Asia reports citing ET News and Wccftech, Micron has secured approval for volume production ahead of its competitors.

The System on Chip Advanced Memory Module (SOCAMM) technology uses LPDDR DRAM to boost performance for low-power high-bandwidth AI computing tasks. Micron says SOCAMM gives 2.5 times more bandwidth while reducing size and power use by a third compared to standard server RDIMM modules. The planned SOCAMM rollout though smaller than NVIDIA’s expected 9 million HBM unit buy for 2025, marks a key market shift. Industry experts see this as a possible game-changer for memory and substrate fields. SOCAMM’s rollout covers business and consumer markets first aiming at AI servers and workstations before moving to personal computers. The technology links cost-effective growth with high-performance AI workload needs.