Foldable iPhone’s Preliminary Specifications Shared By Analysts Include The Advanced 2nm A20 Pro, & New C2 5G Modem, But Camera Hardware Could Miss Out On Telephoto Unit To Reduce Cost
The internal specifications surrounding the foldable iPhone share some polarity, because, on one hand, Apple’s...
Apple To Utilize TSMC’s Advanced WMCM And SoIC Packaging For Its A20 And Server Chips, Respectively, With Monthly Production Estimated To Reach 10,000 Wafers In 2026
The first 2nm chipsets are scheduled to arrive next year, with Apple likely being the first to showcase this t...
Apple’s A20 Rumored To Be Exclusive To The iPhone 18 Pro, iPhone 18 Pro Max And The Company’s Foldable Flagship, Will Leverage TSMC’s Advanced 2nm Process Combined With The Newer WMCM Packaging
TSMC might have started accepting orders for its 2nm wafers, but the first chipsets fabricated on this cutting...
Apple’s A20 SoC Based On TSMC’s 2nm N2 Process To Feature A New Design With Advanced WMCM Packaging That Integrates RAM With The Processor, Enhancing Performance, Power Efficiency, And Thermals
The iPhone 17 lineup is still months away from being announced, and we have already started hearing details on...