TSMC Arizona Chips Are Reportedly Being Flown Back to Taiwan For Packaging; U.S. Semiconductor Supply Chain Still Remains Dependent on Taiwan
The US chip supply chain hasn't entirely achieved self-reliance, as according to a new report, chips made by T...
Apple To Utilize TSMC’s Advanced WMCM And SoIC Packaging For Its A20 And Server Chips, Respectively, With Monthly Production Estimated To Reach 10,000 Wafers In 2026
The first 2nm chipsets are scheduled to arrive next year, with Apple likely being the first to showcase this t...
Apple’s A20 Rumored To Be Exclusive To The iPhone 18 Pro, iPhone 18 Pro Max And The Company’s Foldable Flagship, Will Leverage TSMC’s Advanced 2nm Process Combined With The Newer WMCM Packaging
TSMC might have started accepting orders for its 2nm wafers, but the first chipsets fabricated on this cutting...
Nintendo Switch 2 consoles arrive damaged as retailer staples receipts on outer packaging
Customers are reporting that they are receiving their all-new Nintendo Switch 2 consoles with receipts stapled...
Apple’s A20 SoC Based On TSMC’s 2nm N2 Process To Feature A New Design With Advanced WMCM Packaging That Integrates RAM With The Processor, Enhancing Performance, Power Efficiency, And Thermals
The iPhone 17 lineup is still months away from being announced, and we have already started hearing details on...
Oreo goes to war with Aldi in US over packaging dispute –
If you've been to Aldi, you know that the supermarket can be a bit sneaky when it comes to its packaging desig...
Intel Details EMIB-T Advanced Packaging for HBM4 and UCIe
This week at the Electronic Components Technology Conference (ECTC), Intel introduced EMIB-T, an important upg...
Siemens and Intel Foundry Collaborates on Integrated Circuits and Advanced Packaging Solutions for 2D and 3D IC
Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has re...