Xiaomi Envisions Proprietary Chipset Designs Being Deployed in non-Flagship Mobile Devices

Lu Weibing—a company president and partner—has outlined a vision for XRING’s eventual expansion beyond a flagship/high-end product tier. Last week’s intro firmly positioned the 3 nm part as premium option that will power suitably expensive Android-based mobile devices. Weibing acknowledged that his team has jumped into the deep end: “(for) this platform capability, it is most difficult to work on smartphone flagship SoC, it has high power consumption demand and its technology is extremely complicated. If you can, then you should have the ability to work on flagship smartphone SoC. (Once you) move to work on other chips, it won’t be that difficult.” Industry moles posit that Xiaomi’s XRING division is already a formidable force, in terms of staff headcounts and experience. The department could be absorbing some inspiration from Apple; namely their custom C1 modem chip. The firm’s president painted a picture of things to come: “so we want to focus on the flagship SoC, and then we want to make a capable modem for the future. We have to work on 4G and 5G parts—together with 3G—leading to a complete matrix. So that is what we need to do at this stage.” Early leaks have indicated the existence of a binned version of the XRING O1 SoC; present within early Xiaomi Pad 7 Ultra tablet samples. In theory, these compromised chips could be deployed in unannounced cheaper products.